基于銅基的多層氮化硼薄膜（52.5cm）

簡要描述：Specifications:
Close to complete coverage （90-95%）, with some minor holes
Average Thickness of BN film is 13 nm
Thickness of the copper foil is 20 microns
Quality is confirmed by TEM.

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廠商性質：生產廠家
更新時間：2024-06-03
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詳細介紹

Specifications:

Close to complete coverage (90-95%), with some minor holes

Average Thickness of BN film is 13 nm

Thickness of the copper foil is 20 microns

Quality is confirmed by TEM. TEM shows perfect hexagonal structure.

Specifications:

Close to complete coverage (90-95%), with some minor holes

Average Thickness of BN film is 13 nm

Thickness of the copper foil is 20 microns

Quality is confirmed by TEM. TEM shows perfect hexagonal structure.

Specifications:

Close to complete coverage (90-95%), with some minor holes

Average Thickness of BN film is 13 nm

Thickness of the copper foil is 20 microns

Quality is confirmed by TEM. TEM shows perfect hexagonal structure.

TEM image of perfect hexagonal structure

AFM image of multilayer BN on Cu

AFM scan of multilayer BN on Cu

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上海巨納科技有限公司公司地址：上海市虹口區寶山路778號海倫國際大廈5樓技術支持：化工儀器網

聯系人：袁文軍
QQ：494474517
公司座機：86-021-56830191
郵箱：yuanwenjun@sunano.com.cn

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基于銅基的多層氮化硼薄膜（52.5cm）

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